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Fabric Interconnect Networking Software (FIN-S) Embedded Clustering (EC) Package

Concurrent Technologies Fabric Interconnect Networking Software (FIN-S) is a family of software packages that provides a rich fabric software ecosystem allowing applications on multiple processor boards to communicate with each other. To address different use cases, FIN-S is split into two functional packages: Embedded Clustering (EC) and Device Communication (DCOM). The EC package enables multiple Concurrent Technologies’ boards to communicate with each other over a socket interface to provide a clustering solution. The DCOM package enables a point to point communications interface between multiple Concurrent Technologies’ boards and third party boards.


  • IP socket based communication interface
  • Ability to run off-the-shelf OpenDDS and OpenMPI communication middleware
  • Support for the latest interconnect fabrics:
    • RapidIO®
    • PCI Express®
  • FIN-S DCOM package enables communication:
    • between Concurrent Technologies and 3rd party boards
    • utilizing either RapidIO and PCI Express fabrics
  • Available on a range of system architectures:
    • VPX™
    • AMC
  • Operating Systems supported:
    • Linux®, Windows® and VxWorks®
    • contact your local sales office for latest operating system support
  • Available on range of Concurrent Technologies boards utilizing Intel® and ARM® processors including:
    • Intel® Core™ i7 processors
    • Intel® Atom™ processors
    • NVIDIA® Tegra® K1 processors
  • Contact your local sales office for further details