Chinese language English language

 

Specification Sheet: TP 402/35x-RA

Intel® Core 2 Duo Processor 3U SBC
Ruggedized Air-Cooled

(click to view Ruggedized Conduction-Cooled or Commercial Air-Cooled)



Ruggedized Single Board Computer

  • ruggedized air-cooled version
  • conformally coated
  • commercial air-cooled version available
  • ruggedized conduction-cooled version available

Central Processor

  • 1.06 GHz Intel® Core 2 Duo processor U7500 or
    1.5 GHz Intel Core 2 Duo processor L7400:-
    • using a µFC-BGA 478 (micro Flip-Chip Ball Grid Array) package
    • 64 Kbytes of primary (L1) on-die cache
    • 4 Mbytes of shared secondary (L2) on-die cache
    • 667 MHz Front Side Bus (FSB)
    • Intel® 64 Technology (64-bit computing)
  • utilizes 64-bit Intel® 3100 server chipset:-
    • single chip chipset with integrated memory and I/O controllers
  • provision for ITP debug port

DRAM

  • 2 or 4 Gbytes soldered DDR2-400 registered ECC SDRAM using:-
    • single channel memory
    • single-bit error correction
    • peak bandwidth of up to 3.2 Gbytes/s
  • accessible from processor or CompactPCI® bus

Hard/Flash Disk Interfaces

  • 5 x Serial ATA150 interfaces:-
    • transfer rate up to 150 Mbytes/s
  • 2 x channels accessible via J2
  • 1 x channel routed to on-board 512 Mbytes Flash disk
  • 2 x channels routed to optional Flash Disk Module:-
    • one or two Flash disk drives
    • uses XMC connectors (see Note 1)

Ethernet Interfaces

  • 2 x channels supporting:-
    • 10 Base-T, 100 Base-TX, 1000 Base-T
    • implemented by Intel® 82571EB via x4 PCI Express® port
    • both channels accessed via J2

Optional Graphics Interface

  • optional ruggedized PMC card mounted on ruggedized 3U CompactPCI PMC carrier:-
  • for IO PMC/722-RA:-
    • implemented by Silicon Motion SM722
    • analog and digital graphics accessed via front panel DVI-I connector or PMC rear I/O
    • 8 Mbytes video memory
    • resolutions up to 1280 x 1024; supporting up to 16M colors

Serial Interfaces

  • 2 serial interfaces accessible via J2
  • 1 x RS232 interface supporting Tx and Rx
  • 1 x RS232 interface supporting Tx, Rx, RI, CTS, RTS, DSR, DTR and DCD or 1 x RS422/485 supporting Tx and Rx
  • 16550 compatible UARTs

Flash EPROM

  • 1 Mbyte of BIOS Flash EPROM
  • hardware write protect provided

Other Peripheral Interfaces

  • PC-compatible Real Time Clock (Year 2000 compliant)
  • long duration timer
  • watchdog timer
  • legacy speaker interface
  • 2 x USB 2.0 interfaces:-
    • both accessed via J2
  • external battery supply for RTC and BIOS data
  • 4 x GPIO signals via J2
  • on-board I2C bus used for local temperature and power supply sensors, accessible via J1

CompactPCI Interface

  • universal signaling support, compliant with PICMG 2.0 R3.0; 3.3V or 5V signaling levels
  • 33/66 MHz; 32-bit interface accessed via J1
  • utilizing a PCI Express-PCI bridge for off-board accesses
  • operates as a System Slot controller (supporting up to 7 peripheral slots) or operates in a Peripheral Slot:-
    • supports hot-swapping peripheral boards
    • PICMG 2.1 R2.0 Hot Swap Specification
  • option to disable CompactPCI interface (Satellite Mode):-
    • receives power from CompactPCI bus
    • board can be hot swapped

Firmware Support

  • Phoenix TrustedCore BIOS
  • Trusted Platform Module (TPM) support
  • comprehensive Power-On Self-Test (POST)
  • LAN boot firmware included

Software Support

  • supports Linux®, Windows® XP, Windows® XP Embedded, Windows® 2000, Windows® Server 2003, QNX®, LynxOS® and VxWorks®

Electrical Specification

  • +5V @ 3.1A (typical at 1.5 GHz, 1Gbyte DRAM)
  • +3.3V @ 3.7A (typical with 1Gbyte DRAM)
  • voltages +5%/-3%
  • +12V and -12V not required

Safety

  • PCB (PWB) manufactured with flammability rating of 94V-0

Environmental Specification

  • operating temperatures:-
    • -40°C to +75°C
  • storage temperature:-
    • VITA 47 Class C3, -50°C to +100°C
  • altitude (operating):
    • -1,000 to 33,000 feet (-305 to 10,058 meters)
  • 5% to 95% Relative Humidity, non condensing (operating/storage)
  • commercial air-cooled version:-
  • ruggedized conduction-cooled version:-

Mechanical Specification

  • 3U form-factor:
    3.9-inches x 6.3-inches (100mm x 160mm)
  • single slot
  • connectors: IEC-1076-4-101 for J1-J2
  • operating mechanical:-
    • shock - VITA 47 Class OS2, 40g
  • random vibration - VITA 47 Class V2, 0.04g²/Hz

 

Note 1: The XMC connectors are provided for the SATA Flash Disk Module only. The CPU heatsink for air-cooled boards does not allow an XMC module. The conduction-cooled board does support an optional XMC module (see the TP 402/35x-RC datasheet).