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Specification Sheet: VP 717/08x
Intel® Core i7 Processor Dual PMC/XMC Embedded Controller

(click to view Ruggedized Air-Cooled or Rugged Conduction-Cooled)



Central Processor

  • 2.53 GHz Intel® Core i7-610E processor,
    2.0 GHz Intel® Core i7-620LE processor or
    1.33 GHz Intel® Core i7-660UE processor
  • common processor features are:-
    • 32nm process technology
    • dual-core processor
    • 4 Mbytes shared last level cache
    • Intel® Hyper-Threading Technology
    • Intel® 64 Technology (64-bit computing)
    • Intel® Turbo Boost technology
    • uses Ball Grid Array package
  • processor to DRAM memory, bus speed:-
    • 610E and 620LE - 1066MHz
    • 660UE - 800MHz
  • graphics engine, core clock speed:-
    • 610E - 500MHz
    • 620LE - 266MHz
    • 660UE - 166MHz
    • Intel Turbo Boost technology allows faster
    graphics engine speed depending on the CPU loading
  • utilizes Intel® Platform Controller Hub (PCH):-
    • Mobile Intel® QM57 Express chipset

DRAM

  • up to 8 Gbytes DDR3-1066 ECC SDRAM:-
    • up to 8 Gbytes soldered on-board
    • single bit error correction
    • peak bandwidth of 17 Gbytes/s
    • dual channel architecture
  • accessible from processor or VME bus

Mass Storage Interfaces

  • 2 x external drive interfaces supporting:-
    • single EIDE drive via P2 connector
    • single SATA300 drive via P0 (see Note 1)
  • optional on-board 2.5 inch SATA300 disk drive
  • 1 x EIDE interface supports on-board CompactFlash socket

Ethernet Interfaces

  • two interfaces supporting 10/100/1000 Mbps:-
    • implemented by Intel® 82576EB LAN
    Controller via x4 PCI Express® link
    • both interfaces accessed via optional P0
    (see Note 1)
    • 1 channel switchable to front panel RJ45
  • support for VITA 31.1:-
    • Gigabit Ethernet for VME64x backplanes

PMC/XMC Interfaces

  • 2 x PMC/XMC shared sites:-
    • PMC sites support 32/64-bit, 33/66/100MHz PCI-X operation
    • PCI 3.3V or 5V signaling
    • XMC (Switched Mezzanine Card) sites support x8 PCI Express® links
    • XMC sites powered from 5V supply
  • PMC Site 1 I/O via front panel and P2
  • PMC Site 2 I/O via front panel and optional P0 (see Note 1)
  • expansion to optional dual PMC carrier board:-
    • via expansion connector (32-bit/33 MHz)
    • or via PMC/XMC site 2 (64-bit/66 MHz)

Graphics Interface

  • implemented by the integrated chipset graphics controller
  • resolutions up to 2048 x 1536 @ 16M colors
  • analog graphics accessed via front panel 26-way high-density connector or optional P0

Serial Interfaces

  • 3 x serial channel interfaces:-
    • 1 x RS232 accessed via 26-way high density connector on front panel
    • 2 x RS232/422/485 accessed via P2
  • 16550 compatible UARTs

Other Peripheral Interfaces

  • PC-compatible Real Time Clock
  • 3 x USB 2.0 interfaces:-
    • 1 x USB via a 26-way high-density connector on front panel
    • 1 x USB via P2 connector
    • option for USB via P0 connector (see Note 1)
  • keyboard and mouse interfaces accessed via a 26-way high-density connector on front panel or optionally via P0 connector
  • watchdog timer
  • 1 x 32-bit Long Duration Timer with processor interrupt capability

Flash EPROM

  • 8 Mbytes of BIOS Flash EPROM
  • 64 Mbytes of Application Flash EPROM

Software Support

  • support for Linux®, Windows® 7, Windows® Embedded Standard 7, Windows® XP, Windows® XP Embedded, Windows® Server 2003, Windows® Server 2008, VxWorks®, QNX®, Solaris and LynxOS®

Firmware Support

  • UEFI-compliant BIOS with legacy mode support
  • comprehensive Power-On Self-Test (POST)
  • LAN boot firmware included

VME Interface

  • P1 and P2 connectors compatible with VME64x
  • implemented using IDT®/Tundra® Tsi148device
  • VME Master/Slave
  • A32/A24/A16/D64/D32/D16/D8(EO)/MBLT64
  • fast hardware byte swapping
  • auto system controller detect
  • full interrupter / interrupt handler support
  • bus error interrupt hardware

Safety

  • PCB (PWB) manufactured with flammability rating of 94V-0

Electrical Specification

  • +5V @ 10.2A (typical with 2.53 GHz processor and 4 Gbytes SDRAM)
  • +12V@0.0A; -12V@0.0A; 3.3V not required
  • +12V and -12V routed to both PMC/XMC sites and PMC expansion connector

Environmental Specification

  • operating temperatures:-
    • 0°C to +55°C (N-Series)
    • -25°C to +70°C (E-Series: 2.0 GHz or 1.33 GHz)
    • -40°C to +85°C (K-Series: 1.33 GHz)
  • storage temperature: -40°C to +85°C
  • 5% to 95% Relative Humidity, non condensing (operating or storage):-
    • K-Series includes humidity sealant
  • ruggedized versions, see separate datasheets:-

Mechanical Specification

  • 6U form-factor
  • single slot, front panel width 0.8-inch (20.3mm)
  • utilizes 160-way connectors for P1 and P2
  • optional P0
  • IEEE 1101.10 handles
  • shock: 20g, 11ms, ½ sine
  • vibration: 5Hz-2000Hz at 2g, 0.38mm peak displacement

Note 1: The optional P0 connector supports either PMC Site 2 I/O x64 and 1 x Ethernet or PMC Site 2 I/O x32, SATA, USB and 2 x Ethernet